HTSBM-1 Spot Bonding Machine is used for preparation process before lamination so that ensure lamination quality. This machineadopts electric heating, bonding pressure and bonding time are adjustable, and spot is smooth. The spot bonding head is movable in the full range of guide. It is possible to adopt either edge position or pin-hole position according to the requirement of user.
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Laminating pads are typically required during the card lamination process. Their...
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HTSBM-1 Spot Bonding Machine is used for preparation process before lamination s...
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The HT-220 Hot Stamping Machine is a hot-stamping device developed based on adva...
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No. 58, Mao'ao Village, Oubei Town, Yongjia County, Wenzhou City, Zhejiang Province, China
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