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| HTSBM-2 Full Automatic Spot Bonding Machine |
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HTSBM-2 Full Automatic Spot Bonding Machine is full automatic machine to load the overlay and printed sheet one by one till per set, then ultrasonic bonding the sheets.
It’s used for preparation process before lamination so that ensure lamination quality. This machine adopts electric heating, bonding pressure and bonding time are adjustable, and spot is smooth. The spot bonding head is movable in the full range of guide. It is possible to adopt either edge position or pin-hole position according to the requirement of user.
CLICK ON THE BELOW PRODUCTS FOR MORE INFORMATION
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| © Hengtong Card Making Equipment Co., Ltd. |
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【manager】 |
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